Invention Grant
- Patent Title: Method for improving via's impedance
- Patent Title (中): 改善通路阻抗的方法
-
Application No.: US11392003Application Date: 2006-03-29
-
Publication No.: US07409668B2Publication Date: 2008-08-05
- Inventor: Yu-Hsu Lin , Shang-Tsang Yeh , Chuang-Bing Li
- Applicant: Yu-Hsu Lin , Shang-Tsang Yeh , Chuang-Bing Li
- Applicant Address: CN Bao-an District, Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Bao-an District, Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agency: Morris Manning Martin LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: CN200510036761 20050819
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F19/00

Abstract:
A method is for controlling an impedance of a via of a printed circuit board. The Via is connected with a trace and includes a drill hole, a pad and an anti-pad. The method includes steps of: building a math model; testing whether an impedance of the via matching with an impedance of the trace; analyzing the impedance of the via if passing the testing; and adjusting parameters of the pad, the anti-pad, and the drill hole if fails testing, and returning to the simulating step, till impedance matching achieved. The method which can efficiently keep signals integrality and increase signal transmission speed.
Public/Granted literature
- US20070074905A1 Method for improving via's impedance Public/Granted day:2007-04-05
Information query