Invention Grant
US07438969B2 Filling material, multilayer wiring board, and process of producing multilayer wiring board
有权
填充材料，多层布线板以及多层布线板的制造工序
- Patent Title: Filling material, multilayer wiring board, and process of producing multilayer wiring board
- Patent Title (中): 填充材料，多层布线板以及多层布线板的制造工序
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Application No.: US10615067Application Date: 2003-07-09
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Publication No.: US07438969B2Publication Date: 2008-10-21
- Inventor: Toshifumi Kojima , Makoto Wakazono , Toshikatu Takada
- Applicant: Toshifumi Kojima , Makoto Wakazono , Toshikatu Takada
- Applicant Address: JP Nagoya
- Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JPP.2002-201223 20020710; JPP.2002-380796 20021227; JPP.2003-125477 20030430
- Main IPC: B32B3/00
- IPC: B32B3/00 ; H05K1/03
Abstract:
A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a substrate, a through-hole, the filling material filling the through-hole, and a conductor layer formed on an exposed surface of the filling material in the through-hole; and a process for producing the multilayer printed wiring board.
Public/Granted literature
- US20040009335A1 Filling material, multilayer wiring board, and process of producing multilayer wiring board Public/Granted day:2004-01-15
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