Invention Grant
- Patent Title: Thermally improved placement of power-dissipating components onto a circuit board
- Patent Title (中): 功率耗散元件在电路板上的散热改进
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Application No.: US11146234Application Date: 2005-06-07
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Publication No.: US07443025B2Publication Date: 2008-10-28
- Inventor: Rudi Verbist
- Applicant: Rudi Verbist
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox PLLC
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
The invention refers to an electronic system, comprising several power-dissipating components, and a circuit board, wherein said power-dissipating components are mounted both to a top side and a bottom side of said circuit board. Further, the invention refers to method for mounting power-dissipating components onto a circuit board, comprising the steps of (a) determining the thermal behavior of said power-dissipating components; and (b) determining, in accordance thereto, the placement of said power-dissipating components on both a top side and a bottom side of said circuit board.
Public/Granted literature
- US20050270749A1 Thermally improved placement of power-dissipating components onto a circuit board Public/Granted day:2005-12-08
Information query
IPC分类:
