Invention Grant
- Patent Title: Method for impedance matching between differential vias and transmission lines
- Patent Title (中): 差分通孔和传输线之间的阻抗匹配方法
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Application No.: US11308690Application Date: 2006-04-22
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Publication No.: US07443265B2Publication Date: 2008-10-28
- Inventor: Shou-Kuo Hsu , Cheng-Hong Liu
- Applicant: Shou-Kuo Hsu , Cheng-Hong Liu
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Wei Te Chung
- Priority: CN200510036126 20050721
- Main IPC: H03H7/38
- IPC: H03H7/38
Abstract:
A method for impedance matching between differential vias and associated transmission lines is provided. The method includes: deducing a relationship of a space between the differential vias, and a radius of the differential vias while a characteristic impedance of the differential vias matches a characteristic impedance of the differential transmission lines; and determining the space and the radius according to the relationship between the space and the radius.
Public/Granted literature
- US20070018751A1 METHOD FOR IMPEDANCE MATCHING BETWEEN DIFFERENTIAL VIAS AND TRANSMISSION LINES Public/Granted day:2007-01-25
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