Invention Grant
US07445496B2 Method for contacting flexible printed circuit with another flexible circuitry component and related circuitry assembly
有权
将柔性印刷电路与另一个柔性电路部件和相关电路组件接触的方法
- Patent Title: Method for contacting flexible printed circuit with another flexible circuitry component and related circuitry assembly
- Patent Title (中): 将柔性印刷电路与另一个柔性电路部件和相关电路组件接触的方法
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Application No.: US11457817Application Date: 2006-07-17
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Publication No.: US07445496B2Publication Date: 2008-11-04
- Inventor: Shen-Hong Kao
- Applicant: Shen-Hong Kao
- Applicant Address: TW Neihu, Taipei
- Assignee: Lite-On Technology Corp.
- Current Assignee: Lite-On Technology Corp.
- Current Assignee Address: TW Neihu, Taipei
- Agent Winston Hsu
- Priority: TW95109900A 20060322
- Main IPC: H01R9/07
- IPC: H01R9/07
Abstract:
A method for connecting a flexible printed circuit (FPC) with a flexible circuitry component containing conducting wires is disclosed. The flexible circuitry component has an uncovered conducting portion. The proposed method includes providing a tenon and a holder with a groove corresponding to the tenon; and utilizing the tenon to wedge the uncovered conducting portion of the flexible circuitry component and a connecting region of the FPC in the groove of the holder to cause that the uncovered conducting portion contacts the connecting region.
Public/Granted literature
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