Invention Grant
US07447039B2 Motherboard configured to minimize or prevent damage to a chip thereon
失效
配置为最小化或防止其上的芯片损坏的主板
- Patent Title: Motherboard configured to minimize or prevent damage to a chip thereon
- Patent Title (中): 配置为最小化或防止其上的芯片损坏的主板
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Application No.: US11309887Application Date: 2006-10-17
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Publication No.: US07447039B2Publication Date: 2008-11-04
- Inventor: Chih-Hang Chao , Yu-Hsu Lin , Jeng-Da Wu
- Applicant: Chih-Hang Chao , Yu-Hsu Lin , Jeng-Da Wu
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Wei Te Chung
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.
Public/Granted literature
- US20080089032A1 Motherboard Public/Granted day:2008-04-17
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