Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US11309629Application Date: 2006-09-01
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Publication No.: US07449969B2Publication Date: 2008-11-11
- Inventor: Hai-Yun Zhang
- Applicant: Hai-Yun Zhang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Wei Te Chung
- Priority: CN200510101029 20051104
- Main IPC: H03B5/32
- IPC: H03B5/32 ; H03B5/36 ; H03L1/00

Abstract:
A printed circuit board (PCB) includes a signal layer and a power layer. The signal layer includes a crystal oscillator pad, a clock generator pad, and two capacitor pads. The crystal oscillator pad is connected to the clock generator pad and the capacitor pads via two signal lines. The power layer is divided into two areas by a cut-off line, the two areas respectively having different voltages. The cut-off line is located at one side of the crystal oscillator pad and the clock generator pad.
Public/Granted literature
- US20070103246A1 PRINTED CIRCUIT BOARD Public/Granted day:2007-05-10
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