Provided is a BGA-type multilayer circuit wiring board which is mounted on a printed wiring board directly via a solder ball with the electrode pad for solder ball connection formed thereon and in which the electric connection reliability of the filled via connected to the electrode pad for solder ball connection is not worsened. A wiring layer is formed on both surfaces of an insulating substrate; an electrode pad for solder bump for mounting a semiconductor chip thereon is formed on one surface of the substrate via an insulating layer; and an electrode pad for solder ball for connecting the structure to a printed wiring board is formed on the other surface thereof. The electrode pad for solder ball is electrically connected to the filled via; and the filled via is disposed in the intermediate position between the neighboring electrode pads for solder ball connection.