Invention Grant
US07491896B2 Information handling system utilizing circuitized substrate with split conductive layer
有权
信息处理系统利用具有分裂导电层的电路化基板
- Patent Title: Information handling system utilizing circuitized substrate with split conductive layer
- Patent Title (中): 信息处理系统利用具有分裂导电层的电路化基板
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Application No.: US12010004Application Date: 2008-01-18
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Publication No.: US07491896B2Publication Date: 2009-02-17
- Inventor: John M. Lauffer , James M. Larnerd , Voya R. Markovich
- Applicant: John M. Lauffer , James M. Larnerd , Voya R. Markovich
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Agency: Hinman, Howard & Kattell
- Agent Mark Levy; Lawrence Fraley
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
An information handling system, e.g., a mainframe computer, which includes as part thereof a housing having therein an electrical assembly including a circuitized substrate which in turn includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within the system. At least one electrical component is positioned on and electrically coupled to the circuitized substrate of the system's electrical assembly.
Public/Granted literature
- US20080117583A1 Information handling system utilizing circuitized substrate with split conductive layer Public/Granted day:2008-05-22
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