Invention Grant
- Patent Title: Method and apparatus for marking a printed circuit board
- Patent Title (中): 用于标记印刷电路板的方法和装置
-
Application No.: US11170823Application Date: 2005-06-30
-
Publication No.: US07498521B2Publication Date: 2009-03-03
- Inventor: Brian S. Forbes , William L. Sanderson, IV , Daniel J. Ragland , Tim Menard
- Applicant: Brian S. Forbes , William L. Sanderson, IV , Daniel J. Ragland , Tim Menard
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Buckley, Maschoff & Talwalkar LLC
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/36

Abstract:
A method and apparatus include providing a printed circuit board (PCB) having at least one light permeable layer, at least one non-light permeable layer having at least one void therethrough that may be vertically aligned with the at least one light permeable layer, and a source of illumination to simultaneously illuminate through the void and the at least one light permeable layer.
Public/Granted literature
- US20070002544A1 Method and apparatus for marking a printed circuit board Public/Granted day:2007-01-04
Information query