Invention Grant
US07507519B2 Pattern forming method, wiring pattern forming method, electro-optical device, and electronic apparatus
有权
图案形成方法，布线图案形成方法，电光装置和电子装置
- Patent Title: Pattern forming method, wiring pattern forming method, electro-optical device, and electronic apparatus
- Patent Title (中): 图案形成方法，布线图案形成方法，电光装置和电子装置
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Application No.: US10898338Application Date: 2004-07-26
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Publication No.: US07507519B2Publication Date: 2009-03-24
- Inventor: Naoyuki Toyoda
- Applicant: Naoyuki Toyoda
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2003-290657 20030808
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03C11/00
Abstract:
Aspects of the invention can provide a patterning forming method capable of patterning a thin film by a simple and inexpensive device. The thin film can be provided on a base member including a photothermal conversion material that converts optical energy into thermal energy and light is radiated onto the base member to remove the thin film corresponding to a light-radiated region, such that the thin film is patterned.
Public/Granted literature
- US20050042430A1 Pattern forming method, wiring pattern forming method, electro-optical device, and electronic apparatus Public/Granted day:2005-02-24
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