Invention Grant
- Patent Title: Suspension board with circuit
- Patent Title (中): 悬挂板带电路
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Application No.: US11256800Application Date: 2005-10-24
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Publication No.: US07525764B2Publication Date: 2009-04-28
- Inventor: Tetsuya Ohsawa , Yasuhito Funada , Hitoki Kanagawa
- Applicant: Tetsuya Ohsawa , Yasuhito Funada , Hitoki Kanagawa
- Applicant Address: JP Ibaraki-shi
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Ibaraki-shi
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2004-309774 20041025
- Main IPC: G11B5/60
- IPC: G11B5/60 ; G11B21/21

Abstract:
An area 5 for mounting a magnetic head is formed on a metal board 1, a conductive layer 4 is formed as a circuit pattern via an insulation layer 2 interposed outside this area and up to a metal board 1. A pattern end 4 to be a connection terminal for connection with the terminal of the magnetic head is formed on the circuit pattern, an end face 4a of the pattern end 4 is aligned with an end face 2a of the insulation layer 2 directly beneath it or protruded in the terminating direction from the end face 2a, thereby providing a structure preventing irradiation of a laser beam on the insulation layer 2.
Public/Granted literature
- US20060087769A1 Suspension board with circuit Public/Granted day:2006-04-27
Information query
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