Invention Grant
- Patent Title: Loudspeaker diaphragm
- Patent Title (中): 扬声器隔膜
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Application No.: US11500309Application Date: 2006-08-08
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Publication No.: US07527124B2Publication Date: 2009-05-05
- Inventor: Kunihiko Tokura , Toru Takebe , Masaru Uryu , Takahisa Tagami
- Applicant: Kunihiko Tokura , Toru Takebe , Masaru Uryu , Takahisa Tagami
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JP2005-232208 20050810
- Main IPC: H04R7/02
- IPC: H04R7/02 ; G10K13/00 ; H04R7/10

Abstract:
Wholly aromatic polyamide fibers cut to a length of 0.5 to 5 mm are dispersedly contained in an injection-moldable thermoplastic resin, and the resin is molded by ultrahigh-speed thin-wall injection molding so as to produce a loudspeaker diaphragm in which the wholly aromatic polyamide fibers are dispersed in a direction perpendicular to the resin flow direction, whereby the loudspeaker diaphragm is improved in internal loss.
Public/Granted literature
- US20070034443A1 Loudspeaker diaphragm Public/Granted day:2007-02-15
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