Invention Grant
- Patent Title: Semiconductor package and semiconductor package mounting method
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Application No.: US11273666Application Date: 2005-11-14
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Publication No.: US07541294B2Publication Date: 2009-06-02
- Inventor: Kenichi Shirasaka
- Applicant: Kenichi Shirasaka
- Applicant Address: JP
- Assignee: Yamaha Corporation
- Current Assignee: Yamaha Corporation
- Current Assignee Address: JP
- Agency: Dickstein, Shapiro, LLP.
- Priority: JPP2001-115380 20010413; JPP2002-079371 20020320
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469 ; H01L23/04 ; H01L32/50 ; H01L23/544
Abstract:
To provide a semiconductor package mounting method, with excellent work efficiency, wherein the direction of a semiconductor package can be verified by a simple method before mounting. One corner of a square shaped display section provided on the surface of a semiconductor package body is chamfered such that the chamfer dimensions are different from those of the other corners. If image recognition by a camera determines that this chamfered part is located correctly, the orientation of a semiconductor package is determined to be correct. On the other hand, if image recognition determines that it is not located correctly, the orientation of the semiconductor package is adjusted until it is correct.
Public/Granted literature
- US20060060948A1 Semiconductor package and semiconductor package mounting method Public/Granted day:2006-03-23
Information query
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