A transparent antimicrobial thermoplastic molding composition is disclosed. The composition contains aromatic polycarbonate resin and 0.01 to 3.8 of an antimicrobial compound conforming to formula (I) AgaM1bM22(PO4)3  (I) wherein M1 is at least one ion selected from the group consisting of alkali metal ion, alkaline earth metal ion, ammonium ion and hydrogen ion, M2 a tetravalent metal selected from the group consisting of Ti, Zr and Sn, and where a and b are positive numbers where a+mb=1 where m is a valence of M1, the percent being relative to the weight of the polycarbonate. The composition is suitable for molding articles having good appearance and surface qualities.