Invention Grant
- Patent Title: Manufacturing method of flexible printed wiring board
- Patent Title (中): 柔性印刷电路板的制造方法
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Application No.: US11622950Application Date: 2007-01-12
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Publication No.: US07543376B2Publication Date: 2009-06-09
- Inventor: Toyokazu Yoshino , Katsuya Okamoto , Shigeki Ogata , Shinji Morimoto , Kouji Nakashima
- Applicant: Toyokazu Yoshino , Katsuya Okamoto , Shigeki Ogata , Shinji Morimoto , Kouji Nakashima
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein P.L.C.
- Priority: JPP.2004-305493 20041020; JPP.2004-305494 20041020; JPP.2004-313593 20041028; JPP.2004-342221 20041126; JPP.2006-007086 20060116
- Main IPC: H01K3/10
- IPC: H01K3/10

Abstract:
Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed. As a result, the contact area between the wiring layers 3 and 4 and the conductor 6 filled in the conductor press-fit hole 5 can be enlarged to retain the contact strength between the wiring layers 3 and 4 and the conductor 6 sufficiently thereby to provide a high connection reliability for the layer connection.
Public/Granted literature
- US20070148829A1 MULTI-LAYERED FLEXIBLE PRINT CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF Public/Granted day:2007-06-28
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