Invention Grant
- Patent Title: Microelectromechanical device having a common ground plane layer and a set of contact teeth and method for making aspects thereof
- Patent Title (中): 具有公共接地层和一组接触齿的微机电装置及其制造方法
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Application No.: US11332715Application Date: 2006-01-13
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Publication No.: US07545234B2Publication Date: 2009-06-09
- Inventor: Chia-Shing Chou
- Applicant: Chia-Shing Chou
- Applicant Address: US CA Oak Park
- Assignee: Wireless MEMS, Inc.
- Current Assignee: Wireless MEMS, Inc.
- Current Assignee Address: US CA Oak Park
- Agency: Tope-Mckay & Associates
- Main IPC: H01H51/22
- IPC: H01H51/22
Abstract:
The present invention relates to MEM switches. More specifically, the present invention relates to a system and method for making MEM switches having a common ground plane. One method for making MEM switches includes: patterning a common ground plane layer on a substrate; forming a dielectric layer on the common ground plane layer; depositing a DC electrode region through the dielectric layer to contact the common ground plane layer; and depositing a conducting layer on the DC electrode region so that regions of the conducting layer contact the DC electrode region, so that the common ground plane layer provides a common ground for the regions of the conducting layer.
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