Invention Grant
- Patent Title: Device and method for removing surface areas of a component
- Patent Title (中): 用于去除部件表面积的装置和方法
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Application No.: US10511251Application Date: 2003-03-12
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Publication No.: US07569133B2Publication Date: 2009-08-04
- Inventor: Daniel Körtvelyessy , Ralph Reiche , Jan Steinbach , Marc de Vogelaere
- Applicant: Daniel Körtvelyessy , Ralph Reiche , Jan Steinbach , Marc de Vogelaere
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Priority: DE10215374 20020408; DE10259365 20021218
- International Application: PCT/DE03/00953 WO 20030312
- International Announcement: WO03/085174 WO 20031016
- Main IPC: C25F5/00
- IPC: C25F5/00
Abstract:
Apparatus and process for removing surface regions of a component. The prior art involves removing surface regions of a metallic component by means of electrochemical processes. The electrochemical process is accelerated by the use of a current pulse generator.
Public/Granted literature
- US20050224367A1 Device and method for removing surface areas of a component Public/Granted day:2005-10-13
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