Invention Grant
- Patent Title: Method of improving the stability of a circuit board
- Patent Title (中): 提高电路板稳定性的方法
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Application No.: US11309280Application Date: 2006-07-21
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Publication No.: US07587816B2Publication Date: 2009-09-15
- Inventor: Li Liu
- Applicant: Li Liu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Wei Te Chung
- Priority: CN200510101244 20051111
- Main IPC: H01K3/10
- IPC: H01K3/10
Abstract:
A printed circuit board includes a mounting hole for receiving a connector pin of either of a first SMC and a second SMC, and a signal line. The signal line is electrically connected to the mounting hole by a conductive layer arranged in and about the mounting hole.
Public/Granted literature
- US20070111595A1 PRINTED CIRCUIT BOARD Public/Granted day:2007-05-17
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