Invention Grant
- Patent Title: Visually inspectable surface mount device pad
- Patent Title (中): 目视检查表面贴装装置垫
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Application No.: US11216813Application Date: 2005-08-31
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Publication No.: US07612296B2Publication Date: 2009-11-03
- Inventor: Meta Rohde , Ajay Kumar Poddar , Klaus Juergen Schoepf , Reimund Rebel
- Applicant: Meta Rohde , Ajay Kumar Poddar , Klaus Juergen Schoepf , Reimund Rebel
- Applicant Address: US NJ Paterson
- Assignee: Synergy Microwave Corporation
- Current Assignee: Synergy Microwave Corporation
- Current Assignee Address: US NJ Paterson
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01R12/04
- IPC: H01R12/04 ; H05K1/00
Abstract:
A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.
Public/Granted literature
- US20060042831A1 Visually inspectable surface mount device pad Public/Granted day:2006-03-02
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