Invention Grant
- Patent Title: Rigid-flex printed circuit board with weakening structure
- Patent Title (中): 刚性柔性印刷电路板,结构薄弱
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Application No.: US11785601Application Date: 2007-04-19
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Publication No.: US07615860B2Publication Date: 2009-11-10
- Inventor: Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
- Applicant: Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
- Applicant Address: TW Taoyuan
- Assignee: Advanced Flexible Circuits Co., Ltd.
- Current Assignee: Advanced Flexible Circuits Co., Ltd.
- Current Assignee Address: TW Taoyuan
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L23/12

Abstract:
A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure formed along each joint of the connection section and the first and second sections. Each FPCB has a bending section corresponding to the connection section on the RPCB; first and second sections separately extended from two lateral edges of the bending section and having at least one RPCB bonding side each corresponding to the FPCB bonding sides of the first and second sections of the RPCB. When a proper pressure is applied against the weakening structures, the RPCB may be easily bent broken at the weakening structures to remove the connection section therefrom.
Public/Granted literature
- US20080257587A1 Rigid-flex printed circuit board with weakening structure Public/Granted day:2008-10-23
Information query
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