Invention Grant
- Patent Title: Conduction structure for infrared microbolometer sensors
- Patent Title (中): 红外微测热传感器的传导结构
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Application No.: US11583210Application Date: 2006-10-19
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Publication No.: US07633065B2Publication Date: 2009-12-15
- Inventor: Ming-Ren Lian , Kevin R. Coffey
- Applicant: Ming-Ren Lian , Kevin R. Coffey
- Applicant Address: US FL Boca Raton US FL Orlando
- Assignee: Sensormatic Electronics, LLC,University of Central Florida Research Foundation, Inc.
- Current Assignee: Sensormatic Electronics, LLC,University of Central Florida Research Foundation, Inc.
- Current Assignee Address: US FL Boca Raton US FL Orlando
- Agency: The Small Patent Law Group
- Agent Dean D. Small
- Main IPC: G01J5/24
- IPC: G01J5/24
Abstract:
A conduction structure for infrared microbolometer sensors and a method for sensing electromagnetic radiation may be provided. The microbolometer may include a first conductor layer and a second conductor layer. The microbolometer further may include a bolometer layer between the first conductor layer and the second conductor layer.
Public/Granted literature
- US20080093553A1 Conduction structure for infrared microbolometer sensors Public/Granted day:2008-04-24
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