Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US11941979Application Date: 2007-11-19
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Publication No.: US07635814B2Publication Date: 2009-12-22
- Inventor: Chien-Hung Liu , Shou-Kuo Hsu , Yu-Chang Pai
- Applicant: Chien-Hung Liu , Shou-Kuo Hsu , Yu-Chang Pai
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200710201552 20070831
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween and a first differential pair and a second differential pair each having a positive differential trace and a negative differential trace. The positive differential traces of the two differential pairs are disposed within the first signal layer. The negative differential traces of the two differential pairs are disposed within the second signal layer. The positive differential trace of the first differential pair is defined at the left side of the positive differential trace of the second differential pair. The negative differential trace of the first differential pair is defined at the right side of the negative differential trace of the second differential pair.
Public/Granted literature
- US20090056983A1 PRINTED CIRCUIT BOARD Public/Granted day:2009-03-05
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