Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12104660Application Date: 2008-04-17
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Publication No.: US07635912B2Publication Date: 2009-12-22
- Inventor: Daisuke Ejima
- Applicant: Daisuke Ejima
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2007-110178 20070419
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A resin layer covering a semiconductor chip on a wiring board is composed of a first resin layer and a second resin layer, wherein the first resin layer and the second resin layer differ in their plan view pattern, satisfying a relation of a
Public/Granted literature
- US20080258317A1 SEMICONDUCTOR DEVICE Public/Granted day:2008-10-23
Information query
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