Invention Grant
- Patent Title: Printed circuit board and electronic apparatus
- Patent Title (中): 印刷电路板和电子设备
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Application No.: US12042182Application Date: 2008-03-04
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Publication No.: US07639503B2Publication Date: 2009-12-29
- Inventor: Makoto Tanaka
- Applicant: Makoto Tanaka
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2007-088831 20070329
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
According to one embodiment, a printed circuit board comprises a printed wiring board, circuit component, reinforcing plate and first and second fixing portion. The printed wiring board includes first and second areas. The first fixing portion is provided on a border line that defines the first and second areas. The first fixing portion can fix the reinforcing plate to both the first and second areas. The second fixing portion comprises a pair of elements arranged symmetrical with respect to the border line.
Public/Granted literature
- US20080239667A1 PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS Public/Granted day:2008-10-02
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