中科微点-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US07640660B2 Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibers 有权
包含碳纤维和玻璃纤维的多层布线板的制造方法

Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibers
Abstract:
A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).
Abstract(Chinese):

多层布线板（X1）包括芯部（100）和外芯布线部（30）。 芯部（100）包括由碳纤维材料（11）和树脂组合物（12）构成的碳纤维增强部（10），以及具有层叠结构的芯内配线部（20） 包含玻璃纤维材料（21a）的绝缘层（21）和由弹性模量为10〜40GPa的导体构成并与碳纤维增强部（10）接合的布线图案（22）。 外芯接线部（30）具有至少一个绝缘层（31）和布线图案（32）的叠层结构，并且在芯部布线部（20）处与芯部（100）接合。

Public/Granted literature
Information query
Espacenet
Patent Agency Ranking
0/0