Invention Grant
- Patent Title: Floor support systems and methods
- Patent Title (中): 地板支撑系统和方法
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Application No.: US11757899Application Date: 2007-06-04
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Publication No.: US07640702B2Publication Date: 2010-01-05
- Inventor: David E. Termohlen
- Applicant: David E. Termohlen
- Applicant Address: US NV Las Vegas
- Assignee: Thornton-Termohlen Group Corporation
- Current Assignee: Thornton-Termohlen Group Corporation
- Current Assignee Address: US NV Las Vegas
- Agency: Townsend, Townsend & Crew LLP
- Main IPC: E04C2/52
- IPC: E04C2/52 ; E04H1/00 ; E04B1/00

Abstract:
According to the invention, a system for supporting a floor structure from a central structure is disclosed. The system may include a plurality of receptacles and a plurality of support members. Each of the receptacles may be located within a corner of an exterior perimeter of the central structure. Each of the receptacles may also at least partially define a cavity which may open to two different sides of the central structure. Each of the support members may be configured to pass through the cavity of at least one of the receptacles. Furthermore, each of the support members may be configured to be supported by at least one of the receptacles, and extend outward from two different sides of the central structure. The support members may further be configured to support the floor structure on two different sides of the central structure.
Public/Granted literature
- US20080295427A1 FLOOR SUPPORT SYSTEMS AND METHODS Public/Granted day:2008-12-04
Information query
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