Invention Grant
- Patent Title: Hot water supply system
- Patent Title (中): 热水供应系统
-
Application No.: US11630617Application Date: 2005-07-01
-
Publication No.: US07640763B2Publication Date: 2010-01-05
- Inventor: Tadafumi Nishimura , Takahiro Yamaguchi
- Applicant: Tadafumi Nishimura , Takahiro Yamaguchi
- Applicant Address: JP Osaka
- Assignee: Daikin Industries, Ltd.
- Current Assignee: Daikin Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2004-195154 20040701
- International Application: PCT/JP2005/012218 WO 20050701
- International Announcement: WO2006/004046 WO 20060112
- Main IPC: F25B27/00
- IPC: F25B27/00

Abstract:
A hot water supply system (10) is provided which includes a first refrigerant circuit (20), an intermediate temperature water circuit (40), a second refrigerant circuit (60), and a high temperature water circuit (80). The first refrigerant circuit (20) constitutes a heat pump which uses the outdoor air as a heat source, and heats heat transfer water in the intermediate temperature water circuit (40). In the intermediate temperature water circuit (40), the heat transfer water is circulated between a radiator (45) for floor heating and a first heat exchanger (30) and between a second heat exchanger (50) and the first heat exchanger (30). The second refrigerant circuit (60) constitutes a heat pump which uses the heat transfer water in the intermediate temperature water circuit (40) as a heat source, and heats water for hot water supply in the high temperature water circuit (80).
Public/Granted literature
- US20090211282A1 Hot water supply system Public/Granted day:2009-08-27
Information query