Invention Grant
- Patent Title: Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same
- Patent Title (中): 集成管道板,其加工方法,加工装置及其加工设备
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Application No.: US11892869Application Date: 2007-08-28
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Publication No.: US07640948B2Publication Date: 2010-01-05
- Inventor: Haretaro Hidaka , Michio Tsukamoto
- Applicant: Haretaro Hidaka , Michio Tsukamoto
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Heavy Industries, Ltd.
- Current Assignee: Mitsubishi Heavy Industries, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2001-026881 20010202; JP2001-176898 20010612; JP2001-205831 20010706; JP2001-267095 20010904
- Main IPC: F16K11/20
- IPC: F16K11/20

Abstract:
A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
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