Invention Grant
- Patent Title: Temperature sensor and method of manufacturing the same
- Patent Title (中): 温度传感器及其制造方法
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Application No.: US11730744Application Date: 2007-04-03
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Publication No.: US07641388B2Publication Date: 2010-01-05
- Inventor: Kyutaro Hayashi
- Applicant: Kyutaro Hayashi
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2006-104611 20060405
- Main IPC: G01K13/00
- IPC: G01K13/00
Abstract:
A temperature sensor includes a temperature sensor element, a housing and a supporting member. The temperature sensor element detects a temperature of media. The housing accommodates a terminal electrically connected to an outside circuit. The terminal is connected to the temperature sensor element through a lead having a strength insufficient for supporting the temperature sensor element. The supporting member accommodates the lead. The supporting member is made of a hot-melt adhesive, and connected to a part of the housing.
Public/Granted literature
- US20070237205A1 Temperature sensor and method of manufacturing the same Public/Granted day:2007-10-11
Information query
