Invention Grant
- Patent Title: Camera module
- Patent Title (中): 相机模块
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Application No.: US11853629Application Date: 2007-09-11
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Publication No.: US07641403B2Publication Date: 2010-01-05
- Inventor: Takashi Ishizawa , Tomohiko Osaka
- Applicant: Takashi Ishizawa , Tomohiko Osaka
- Applicant Address: JP
- Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee Address: JP
- Agency: Marger Johnson & McCollom, P.C.
- Priority: JP2006-249708 20060914
- Main IPC: G03B17/00
- IPC: G03B17/00

Abstract:
A camera module includes a holder provided with a lens unit and displaceable along an optical axis; a coil formed from a wound wire having lead wires; a yoke and magnets for providing a magnetic field to the coil; a flexible printed circuit board for supplying an electrical current to the lead wires; and upper and lower leaf springs for supporting the holder displaceably along the optical axis. Each of the upper and lower springs includes an outer annular portion and an inner annular portion, and coupled by bridge portions. Part of the flexible printed circuit board is formed into a tongue part arranged in a space between a bridge portion of the lower leaf spring and the lead wires to prevent contact with the lead wires.
Public/Granted literature
- US20080069557A1 CAMERA MODULE Public/Granted day:2008-03-20
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