Invention Grant
- Patent Title: Cooling arrangement for CMC components with thermally conductive layer
- Patent Title (中): 具有导热层的CMC部件的冷却布置
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Application No.: US11514745Application Date: 2006-08-31
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Publication No.: US07641440B2Publication Date: 2010-01-05
- Inventor: Jay A. Morrison , Jay E. Lane
- Applicant: Jay A. Morrison , Jay E. Lane
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: F01D5/18
- IPC: F01D5/18

Abstract:
A CMC wall (22) with a front surface (21) heated (24) by a working fluid in a gas turbine. A back CMC surface (23) is coated with a layer (42) of a thermally conductive material to accelerate heat transfer in the plane of the CMC wall (22), reducing thermal gradients (32-40) on the back CMC surface (23) caused by cold spots (32) resulting from impingement cooling flows (26). The conductive material (42) may have a coefficient of thermal conductivity at least 10 times greater than that of the CMC material (22), to provide a minimal thickness conductive layer (42). This reduces thermal gradient stresses within the CMC material (22), and minimizes differential thermal expansion stresses between the CMC material (22) and the thin conductive layer (42).
Public/Granted literature
- US20090238684A1 Cooling arrangement for CMC components with thermally conductive layer Public/Granted day:2009-09-24
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