An assembling member and a heat-dissipating module having the assembling member are proposed. The assembling member connects a fan having at least a receiving space and a plurality of first positioning portions to an electronic host housing having a plurality of first fixing portions. The assembling member includes a main body for being accommodated into the receiving space, a plurality of first coupling portions for coupling with the first positioning portions, an elastic portion disposed at one side of the main body, and a plurality of first engaging portions for engaging with the first fixing portions. The first engaging portions are connected to the elastic portions, such that the first engaging portions can be urged by the elastic portions of the assembling member to engage with the first fixing portions. The heat-dissipating module of the present invention is easy to assemble and disassemble, has simple structure and low cost.