Invention Grant
- Patent Title: Imprint lithography apparatus and method employing an effective pressure
- Patent Title (中): 压印光刻设备和采用有效压力的方法
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Application No.: US10931672Application Date: 2004-09-01
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Publication No.: US07641468B2Publication Date: 2010-01-05
- Inventor: Wei Wu , William M. Tong , Jun Gao , Carl Picciotto
- Applicant: Wei Wu , William M. Tong , Jun Gao , Carl Picciotto
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B29D17/00
- IPC: B29D17/00

Abstract:
An imprint apparatus and method employ an effective pressure in imprint lithography. The imprint apparatus includes a compressible chamber that encloses an imprint mold having a mold pattern and a sample to be imprinted. The chamber is compressed to imprint the mold pattern on the sample. The mold is pressed against the sample with the effective pressure. The effective pressure is controlled by a selected ratio of a cavity area of the chamber to a contact area between the mold and the sample.
Public/Granted literature
- US20060043626A1 Imprint lithography apparatus and method employing an effective pressure Public/Granted day:2006-03-02
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