Invention Grant
US07641479B2 Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material
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利用金属弹性体半环和其他多点接触几何构成的Land Grid阵列插入器（LGA），其由可模制的介电弹性材料构成
- Patent Title: Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material
- Patent Title (中): 利用金属弹性体半环和其他多点接触几何构成的Land Grid阵列插入器（LGA），其由可模制的介电弹性材料构成
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Application No.: US12047664Application Date: 2008-03-13
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Publication No.: US07641479B2Publication Date: 2010-01-05
- Inventor: Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
- Applicant: Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
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