Disclosed is an interposer for accessing one or more signals from an Integrated Circuit (IC) package. The interposer is disposed between the IC package and a socket body. The interposer comprises a plurality of clearance holes and at least one connecting element. The plurality of clearance holes allows an array of contacts on a first surface of the socket body to pass through the interposer and make electrical contact with a first set of contacts of a plurality of contacts of the IC package. The at least one connecting element is configured to make electrical contact with a second set of contacts of the plurality of contacts of the IC package. The electrical contact between the at least one connecting element and the second set of contacts of the plurality of contacts of the IC package provides access to the one or more signals from the IC package.