Provided is an organic light-emitting device capable of cutting an organic light-emitting device panel while suppressing peeling and crack of a sealing layer in a step of cutting the organic light-emitting device panel in which an inorganic sealing layer is formed. The organic light-emitting device includes a substrate having an end portion which includes a divided portion formed by division of the substrate, and an inorganic sealing layer having an end portion including a divided portion formed by division of the inorganic sealing layer, wherein the divided portion of the inorganic sealing layer is positioned on an inner side of a plane of the organic light-emitting device than the divided portion of the substrate.