Invention Grant
- Patent Title: Guide wire
- Patent Title (中): 导丝
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Application No.: US11905818Application Date: 2007-10-04
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Publication No.: US07641622B2Publication Date: 2010-01-05
- Inventor: Hideo Satou , Katsuro Mishima
- Applicant: Hideo Satou , Katsuro Mishima
- Applicant Address: JP Shibuya-Ku, Tokyo
- Assignee: Terumo Kabushiki Kaisha
- Current Assignee: Terumo Kabushiki Kaisha
- Current Assignee Address: JP Shibuya-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2007-031315 20070209
- Main IPC: A61B5/00
- IPC: A61B5/00 ; A61M25/00

Abstract:
A guide wire includes an elongated flexible wire body and a tubular member disposed so as to cover the outer periphery of a portion of the wire body on the distal end side. The tubular member includes a lamination portion having an inner layer and an outer layer made of a resin material, and a reinforcing member disposed between the inner layer and the outer layer and formed by winding a wire material spirally. The reinforcing member reinforces the lamination portion.
Public/Granted literature
- US20080194992A1 Guide wire Public/Granted day:2008-08-14
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