Invention Grant
- Patent Title: Method of thermal adherend release and apparatus for thermal adherend release
- Patent Title (中): 热粘合剂释放方法和热粘贴层释放装置
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Application No.: US11296323Application Date: 2005-12-08
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Publication No.: US07641760B2Publication Date: 2010-01-05
- Inventor: Tomoko Doi , Daisuke Shimokawa , Yukio Arimitsu
- Applicant: Tomoko Doi , Daisuke Shimokawa , Yukio Arimitsu
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JPP.2004-356463 20041209
- Main IPC: B32B38/10
- IPC: B32B38/10

Abstract:
A method of thermal adherend release, wherein a part of adherends adherent to a heat-peelable pressure-sensitive adhesive sheet having a heat-expandable layer containing a foaming agent are selectively released from the pressure-sensitive adhesive sheet by partly heating the heat-peelable pressure-sensitive adhesive sheet, wherein the method comprises previously heating a sticking site of an adherend to be released at a temperature at which the heat-expandable layer of the heat-peelable pressure-sensitive adhesive sheet does not expand and then heating the sticking site of the adherend in the heat-peelable pressure-sensitive adhesive sheet at a temperature at which the heat-expandable layer expands to thereby selectively releasing the adherend.
Public/Granted literature
- US20060124241A1 Method of thermal adherend release and apparatus for thermal adherend release Public/Granted day:2006-06-15
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