Invention Grant
- Patent Title: Plating solution, process for producing a structure with the plating solution, and apparatus employing the plating solution
- Patent Title (中): 电镀液，电镀液的制造方法以及使用电镀液的装置
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Application No.: US10566949Application Date: 2005-01-14
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Publication No.: US07641783B2Publication Date: 2010-01-05
- Inventor: Shigeru Ichihara , Tohru Den , Nobuhiro Yasui
- Applicant: Shigeru Ichihara , Tohru Den , Nobuhiro Yasui
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2004-009238 20040116; JP2004-271466 20040917
- International Application: PCT/JP2005/000732 WO 20050114
- International Announcement: WO2005/068688 WO 20050728
- Main IPC: C25D3/56
- IPC: C25D3/56 ; C25D3/52 ; G11B5/858 ; H01F10/14
Abstract:
A stable FePt plating solution is provided. Further, a process for electroplating is provided for producing an FePt magnetic material having an especially strong coercive force and excellent properties by using the plating solution. The plating solution contains ionic Fe, ionic Pt, and a complex agent, at a molar ratio (Fe/Pt) of the ionic Fe to the ionic Pt ranging from 0.75 to 3.
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