Invention Grant
US07642018B2 Photosensitive resin composition, pattern forming method and electronic parts using the photosensitive resin composition
有权
光敏树脂组合物,图案形成方法和使用感光性树脂组合物的电子部件
- Patent Title: Photosensitive resin composition, pattern forming method and electronic parts using the photosensitive resin composition
- Patent Title (中): 光敏树脂组合物,图案形成方法和使用感光性树脂组合物的电子部件
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Application No.: US11688610Application Date: 2007-03-20
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Publication No.: US07642018B2Publication Date: 2010-01-05
- Inventor: Dai Kawasaki , Nagatoshi Fujieda , Nori Sasaki , Noriyuki Yamazaki
- Applicant: Dai Kawasaki , Nagatoshi Fujieda , Nori Sasaki , Noriyuki Yamazaki
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical DuPont MicroSystems, Ltd.
- Current Assignee: Hitachi Chemical DuPont MicroSystems, Ltd.
- Current Assignee Address: JP Tokyo
- Priority: JP2006-077630 20060320; JP2007-042763 20070222
- Main IPC: G03F7/037
- IPC: G03F7/037 ; G03F7/40

Abstract:
A photosensitive resin composition includes (a) a polymer mainly composed of a repeating unit represented by the following general formula (I); (b) a dissolution accelerator for a developing solution; and (c) a solvent: wherein R1 is a trivalent or tetravalent organic group, R2 is a bivalent organic group, R is a monovalent organic group having a carbon-carbon unsaturated double bond or a group represented by O−M+ (M+ represents a hydrogen ion or a cation composed of hydrogen and a compound having the carbon-carbon unsaturated double bond) in which the compound having the carbon-carbon unsaturated double bond is ionically bonded, at least one carbon-carbon unsaturated double bond is contained in all repeating units, m is an integer of 2 or more, and n is 1 or 2.
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