Invention Grant
US07642018B2 Photosensitive resin composition, pattern forming method and electronic parts using the photosensitive resin composition 有权
光敏树脂组合物,图案形成方法和使用感光性树脂组合物的电子部件

Photosensitive resin composition, pattern forming method and electronic parts using the photosensitive resin composition
Abstract:
A photosensitive resin composition includes (a) a polymer mainly composed of a repeating unit represented by the following general formula (I); (b) a dissolution accelerator for a developing solution; and (c) a solvent: wherein R1 is a trivalent or tetravalent organic group, R2 is a bivalent organic group, R is a monovalent organic group having a carbon-carbon unsaturated double bond or a group represented by O−M+ (M+ represents a hydrogen ion or a cation composed of hydrogen and a compound having the carbon-carbon unsaturated double bond) in which the compound having the carbon-carbon unsaturated double bond is ionically bonded, at least one carbon-carbon unsaturated double bond is contained in all repeating units, m is an integer of 2 or more, and n is 1 or 2.
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