Invention Grant
US07642034B2 Polymer, resist protective coating material, and patterning process
有权
聚合物,抗蚀剂保护涂层材料和图案化工艺
- Patent Title: Polymer, resist protective coating material, and patterning process
- Patent Title (中): 聚合物,抗蚀剂保护涂层材料和图案化工艺
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Application No.: US11699485Application Date: 2007-01-30
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Publication No.: US07642034B2Publication Date: 2010-01-05
- Inventor: Jun Hatakeyama , Koji Hasegawa , Yuji Harada
- Applicant: Jun Hatakeyama , Koji Hasegawa , Yuji Harada
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-022351 20060131; JP2006-232910 20060830
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; C08F218/00

Abstract:
A polymer comprising repeat units having formula (1) wherein R1 and R2 are hydrogen or C1-C12 alkyl, or R1 and R2 may bond together to form a ring, and R30 is hydrogen or methyl is used to formulate a resist protective coating material. A protective coating formed therefrom on a resist film is water-insoluble, dissolvable in alkali aqueous solution or alkaline developer, and immiscible with the resist film so that the immersion lithography can be conducted in a satisfactory manner. During alkali development, development of the resist film and removal of the protective coating can be simultaneously achieved.
Public/Granted literature
- US20070178407A1 Polymer, resist protective coating material, and patterning process Public/Granted day:2007-08-02
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