Invention Grant
US07642125B2 Phase change memory cell in via array with self-aligned, self-converged bottom electrode and method for manufacturing
有权
具有自对准,自会聚底电极的通孔阵列中的相变存储单元及其制造方法
- Patent Title: Phase change memory cell in via array with self-aligned, self-converged bottom electrode and method for manufacturing
- Patent Title (中): 具有自对准,自会聚底电极的通孔阵列中的相变存储单元及其制造方法
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Application No.: US11855979Application Date: 2007-09-14
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Publication No.: US07642125B2Publication Date: 2010-01-05
- Inventor: Hsiang-Lan Lung , Chung Hon Lam
- Applicant: Hsiang-Lan Lung , Chung Hon Lam
- Applicant Address: TW Hsinchu US NY Armonk
- Assignee: Macronix International Co., Ltd.,International Business Machines Corporation
- Current Assignee: Macronix International Co., Ltd.,International Business Machines Corporation
- Current Assignee Address: TW Hsinchu US NY Armonk
- Agency: Haynes Beffel & Wolfeld LLP
- Main IPC: H01L21/06
- IPC: H01L21/06

Abstract:
An array of “mushroom” style phase change memory cells is manufactured by forming a separation layer over an array of contacts, forming an isolation layer on the separation layer and forming an array of memory element openings in the isolation layer using a lithographic process. Etch masks are formed within the memory element openings by a process that compensates for variation in the size of the memory element openings that results from the lithographic process. The etch masks are used to etch through the separation layer to define an array of electrode openings. Electrode material is deposited within the electrode openings; and memory elements are formed within the memory element openings. The memory elements and bottom electrodes are self-aligned.
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