Invention Grant
- Patent Title: Method and system for sealing a substrate
- Patent Title (中): 密封基材的方法和系统
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Application No.: US11779185Application Date: 2007-07-17
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Publication No.: US07642127B2Publication Date: 2010-01-05
- Inventor: Philip Floyd
- Applicant: Philip Floyd
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Mems Technologies, Inc.
- Current Assignee: Qualcomm Mems Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, wherein the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method comprises forming a metal seal on the substrate proximate a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.
Public/Granted literature
- US20070298541A1 METHOD AND SYSTEM FOR SEALING A SUBSTRATE Public/Granted day:2007-12-27
Information query
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