Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12285414Application Date: 2008-10-03
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Publication No.: US07642151B2Publication Date: 2010-01-05
- Inventor: Satoru Muramatsu
- Applicant: Satoru Muramatsu
- Applicant Address: JP Kawasaki, Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kawasaki, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2006-043418 20060221
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
A semiconductor device includes a silicon substrate, a strain-inducing layer, a silicon layer, a FET, and an isolation region. On the silicon substrate, the strain-inducing layer is provided. On the strain-inducing layer, the silicon layer is provided. The strain-inducing layer induces lattice strain in a channel region of the FET in the silicon layer. The silicon layer includes the FET. The FET includes a source/drain region, an SD extension region, a gate electrode and a sidewall. The source/drain region and the strain-inducing layer are spaced from each other. Around the FET, the isolation region is provided. The isolation region penetrates the silicon layer so as to reach the strain-inducing layer.
Public/Granted literature
- US20090047767A1 Semiconductor device and method of manufacturing the same Public/Granted day:2009-02-19
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