Invention Grant
- Patent Title: Semiconductor device and fabrication method thereof
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US11892940Application Date: 2007-08-28
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Publication No.: US07642165B2Publication Date: 2010-01-05
- Inventor: Masao Shingu , Atsuhiro Kinoshita , Yoshinori Tsuchiya
- Applicant: Masao Shingu , Atsuhiro Kinoshita , Yoshinori Tsuchiya
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2006-231532 20060829
- Main IPC: H01L21/8234
- IPC: H01L21/8234

Abstract:
A semiconductor device having a field effect transistor (FET) with enhanced performance by reduction of electrical contact resistance of electrodes and resistance of the electrodes per se is disclosed. The FET includes an n-type FET having a channel region formed in a semiconductor substrate, a gate electrode insulatively overlying the channel region, and a pair of source and drain electrodes which are formed at both ends of the channel region. The source/drain electrodes are made of silicide of a first metal. An interface layer that contains a second metal is formed in the interface between the substrate and the first metal. The second metal is smaller in work function than silicide of the first metal, and the second metal silicide is less in work function than the first metal silicide. A fabrication method of the semiconductor device is also disclosed.
Public/Granted literature
- US20080093676A1 Semiconductor device and fabrication method thereof Public/Granted day:2008-04-24
Information query
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