Invention Grant
- Patent Title: Three-dimensional face-to-face integration assembly
- Patent Title (中): 三维面对面整合装配
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Application No.: US12254577Application Date: 2008-10-20
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Publication No.: US07642173B2Publication Date: 2010-01-05
- Inventor: John McDonald
- Applicant: John McDonald
- Applicant Address: US NY Troy
- Assignee: Rensselaer Polytechnic Institute
- Current Assignee: Rensselaer Polytechnic Institute
- Current Assignee Address: US NY Troy
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L21/46
- IPC: H01L21/46 ; H01L21/4763 ; H01L21/44
Abstract:
A via for connecting metallization layers of chips bonded in a face-to-face configuration is provided, as well as methods of fabricating the via. The via may function as an interconnection of metallization layers in three-dimensional, stacked, integrated circuits, and may enable high density, low-resistance interconnection formation.
Public/Granted literature
- US20090042365A1 THREE-DIMENSIONAL FACE-TO-FACE INTEGRATION ASSEMBLY Public/Granted day:2009-02-12
Information query
IPC分类:
