Invention Grant
- Patent Title: Compound semiconductor element resistible to high voltage
- Patent Title (中): 化合物半导体元件耐高压
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Application No.: US11857458Application Date: 2007-09-19
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Publication No.: US07642556B2Publication Date: 2010-01-05
- Inventor: Shinichi Iwakami
- Applicant: Shinichi Iwakami
- Applicant Address: JP Saitama
- Assignee: Sanken Electric Co., Ltd.
- Current Assignee: Sanken Electric Co., Ltd.
- Current Assignee Address: JP Saitama
- Agency: Bachman & LaPointe, P.C.
- Priority: JP2006-008414 20061017; JP2006-322456 20061129
- Main IPC: H01L31/0256
- IPC: H01L31/0256

Abstract:
A compound semiconductor element is provided which electrically connects an electrode 3 formed on one main surface 2a of a compound semiconductor region 2 with a substrate 5 to fix an electric potential of substrate 5 at an electric potential of electrode 3, thereby preventing fluctuation in electric potential of substrate 5 under the changing operating condition of the device for stabilization in electric property of the device. Also, formed between compound semiconductor region 2 and substrate 5 is an insulating layer 6 for blocking a leakage current which may flow longitudinally between one main surface 2a of compound semiconductor region 2 and substrate 5 so that sufficiently high withstand voltage property can be given between compound semiconductor region 2 and substrate 5. In addition, formed in compound semiconductor region 2 is a notch 14 which extends in the thickness direction from main surface 2a of compound semiconductor region 2 and reaches at least insulating layer 6, and an insulating protective layer 15 covers a side surface of a conductive film 7 exposed to the notch 14 to prevent occurrence of electric discharge between conductive film 7 and substrate 5 for stable and high withstand voltage.
Public/Granted literature
- US20080087897A1 COMPOUND SEMICONDUCTOR ELEMENT RESISTIBLE TO HIGH VOLTAGE Public/Granted day:2008-04-17
Information query
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