Invention Grant
- Patent Title: Field-effect transistor and method of manufacturing the same
- Patent Title (中): 场效应晶体管及其制造方法
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Application No.: US11689527Application Date: 2007-03-22
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Publication No.: US07642567B2Publication Date: 2010-01-05
- Inventor: Hirotaka Amasuga , Masahiro Totsuka
- Applicant: Hirotaka Amasuga , Masahiro Totsuka
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2006-278464 20061012
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
A low-cost field-effect transistor with a moisture-resistant gate covered by a thick moisture-resistant insulating film which suppresses an increase in gate capacitance, and a method of manufacturing the field-effect transistor. The field-effect transistor has one of a T-shaped gate electrode and Γ-shaped gate electrode, a drain electrode, and a source electrode, the source electrode and the drain electrode being electrically connected through an n-doped semiconductor region. The gate, source, and drain electrodes are located on a semiconductor layer which includes an insulating film having a thickness of 50 nm or less and covering a surface of the gate electrode and a surface of the semiconductor layer. A silicon nitride film, deposited by catalytic CVD, covers the insulating film and includes a void volume located between a portion of the gate electrode corresponding to a canopy of an open umbrella and the semiconductor layer.
Public/Granted literature
- US20080087916A1 FIELD-EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2008-04-17
Information query
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