Invention Grant
- Patent Title: Semiconductor device and junction termination structure
- Patent Title (中): 半导体器件和结端接结构
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Application No.: US11331160Application Date: 2006-01-13
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Publication No.: US07642599B2Publication Date: 2010-01-05
- Inventor: Hideaki Ninomiya , Tomoki Inoue
- Applicant: Hideaki Ninomiya , Tomoki Inoue
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2003-322014 20030912
- Main IPC: H01L23/62
- IPC: H01L23/62 ; H01L27/088

Abstract:
A semiconductor device disclosed herein comprises: a first base region which is of a first conductivity type; a second base region which is of a second conductivity type and which is selectively formed on a major surface of the first base region; a stopper region which is of a first conductivity type and which is formed on the major surface of the first base region, the stopper region being a predetermined distance away from the second base region and surrounding the second base region; and a ring region which is of a second conductivity type which is formed on the major surface of the first base region between the second base region and the stopper region, the ring region being spirally around the second base region and electrically connected to the second base region and the stopper region.
Public/Granted literature
- US20060113613A1 Semiconductor device Public/Granted day:2006-06-01
Information query
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